TY - GEN
T1 - Uniformity in patterns imprinted using photo-curable liquid polymer
AU - Hiroshima, H.
AU - Komuro, M.
AU - Inoue, S.
AU - Kasahara, N.
AU - Taniguchi, J.
AU - Miyamoto, I.
N1 - Publisher Copyright:
© 2001 Japan Soc. Of Applied Physics.
PY - 2001
Y1 - 2001
N2 - Imprint lithography reported by Chou et al (Appl. Phys. Lett. vol. 67, p. 3114, 1995) may become one of the most promising lithographic technologies in terms of mass-production and low equipment cost. In particular, those based on photo-induced solidification (Haisma et al, 1996; Bailey et al, 2000) are very attractive because of elimination of heat-up and cool-down time and the possibility of a step and repeat procedure. We have already reported preliminary results (Komuro et al, Jpn. J. Appl. Phys., vol. 39, p. 7075, 2000) by imprint using liquid polymer curable by ultra-violet (UV) light exposure. The paper shows the pattern fabrication process by imprint using photo-curable liquid polymer. The base layer, which is accompanied with a press process, must be removed by etching. In this paper, we describe uniformity in imprinted patterns and reproducibility of our imprint process.
AB - Imprint lithography reported by Chou et al (Appl. Phys. Lett. vol. 67, p. 3114, 1995) may become one of the most promising lithographic technologies in terms of mass-production and low equipment cost. In particular, those based on photo-induced solidification (Haisma et al, 1996; Bailey et al, 2000) are very attractive because of elimination of heat-up and cool-down time and the possibility of a step and repeat procedure. We have already reported preliminary results (Komuro et al, Jpn. J. Appl. Phys., vol. 39, p. 7075, 2000) by imprint using liquid polymer curable by ultra-violet (UV) light exposure. The paper shows the pattern fabrication process by imprint using photo-curable liquid polymer. The base layer, which is accompanied with a press process, must be removed by etching. In this paper, we describe uniformity in imprinted patterns and reproducibility of our imprint process.
UR - http://www.scopus.com/inward/record.url?scp=84960372779&partnerID=8YFLogxK
U2 - 10.1109/IMNC.2001.984109
DO - 10.1109/IMNC.2001.984109
M3 - Conference contribution
AN - SCOPUS:84960372779
T3 - 2001 International Microprocesses and Nanotechnology Conference, MNC 2001
SP - 102
EP - 103
BT - 2001 International Microprocesses and Nanotechnology Conference, MNC 2001
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - International Microprocesses and Nanotechnology Conference, MNC 2001
Y2 - 31 October 2001 through 2 November 2001
ER -