TY - GEN
T1 - Three-dimensional measurements of photo curing process with photo-curable resin for UV-nanoimprint by micro-digital-holographic-PTV
AU - Satake, Shin Ichi
AU - Sorimachi, Gaku
AU - Kanai, Takahiro
AU - Taniguchi, Jun
AU - Unno, Noriyuki
PY - 2008
Y1 - 2008
N2 - High time-resolution flow field measurement in the glass plate with covered glass with two holes is performed by micro-DHPTV system. The glass plate with covered glass has two holes that are inside photo-curable resin. The particle measurement is performed during two seconds; the measurement time is covered for curing time. The theoretically curing time is estimated from the irradiation flux of UV source. Moreover, photo-curable resin with changing of temperature is measured to evaluate dependence of temperature. Consequently, the seeding particle tracking can be obtained instantaneously. The three-dimensional displacement from the tracking is mainly caused at the depth direction. The value is in good agreement with the theoretical displacement from UV irradiation flux. Moreover, it is found that the photo curing of the displacement appears to be proportional to increasing the temperature.
AB - High time-resolution flow field measurement in the glass plate with covered glass with two holes is performed by micro-DHPTV system. The glass plate with covered glass has two holes that are inside photo-curable resin. The particle measurement is performed during two seconds; the measurement time is covered for curing time. The theoretically curing time is estimated from the irradiation flux of UV source. Moreover, photo-curable resin with changing of temperature is measured to evaluate dependence of temperature. Consequently, the seeding particle tracking can be obtained instantaneously. The three-dimensional displacement from the tracking is mainly caused at the depth direction. The value is in good agreement with the theoretical displacement from UV irradiation flux. Moreover, it is found that the photo curing of the displacement appears to be proportional to increasing the temperature.
UR - http://www.scopus.com/inward/record.url?scp=70449558458&partnerID=8YFLogxK
U2 - 10.1109/THETA.2008.5167161
DO - 10.1109/THETA.2008.5167161
M3 - Conference contribution
AN - SCOPUS:70449558458
SN - 9781424435777
T3 - 2008 2nd International Conference on Thermal Issues in Emerging Technologies, ThETA 2008
SP - 67
EP - 72
BT - 2008 2nd International Conference on Thermal Issues in Emerging Technologies, ThETA 2008
T2 - 2008 2nd International Conference on Thermal Issues in Emerging Technologies, ThETA 2008
Y2 - 17 December 2008 through 20 December 2008
ER -