TY - GEN
T1 - Study on bent type of UWB antenna built in electronic equipment housing
AU - Momose, Daisuke
AU - Yamamoto, Takahiko
AU - Koshiji, Koji
PY - 2014/1/1
Y1 - 2014/1/1
N2 - In recent years, ultra wideband(UWB) communication has attracted attention as a high-speed and mass wireless communication technology over short distances. In UWB communication, antennas are required to have a low VSWR over the broadband and omni-directional radiation in the horizontal plane. In this study, toward building the antenna within electronic equipment housing, a simple bent-type UWB antenna fed by a microstrip line is proposed, and the characteristics of the antenna fed by an SMA coaxial connector are investigated. As a result, at UWB frequencies, the antenna (either with or without the SMA connector) operated correctly, with a VSWR less than 2.0 and with omni-directional radiation patterns in the horizontal plane.
AB - In recent years, ultra wideband(UWB) communication has attracted attention as a high-speed and mass wireless communication technology over short distances. In UWB communication, antennas are required to have a low VSWR over the broadband and omni-directional radiation in the horizontal plane. In this study, toward building the antenna within electronic equipment housing, a simple bent-type UWB antenna fed by a microstrip line is proposed, and the characteristics of the antenna fed by an SMA coaxial connector are investigated. As a result, at UWB frequencies, the antenna (either with or without the SMA connector) operated correctly, with a VSWR less than 2.0 and with omni-directional radiation patterns in the horizontal plane.
KW - UWB
KW - bending
KW - electromagnetic field analysis
KW - microstrip line
UR - https://www.scopus.com/pages/publications/84903721015
U2 - 10.1109/ICEP.2014.6826793
DO - 10.1109/ICEP.2014.6826793
M3 - Conference contribution
AN - SCOPUS:84903721015
SN - 9784904090107
T3 - 2014 International Conference on Electronics Packaging, ICEP 2014
SP - 803
EP - 806
BT - 2014 International Conference on Electronics Packaging, ICEP 2014
PB - IEEE Computer Society
T2 - 2014 International Conference on Electronics Packaging, ICEP 2014
Y2 - 23 April 2014 through 25 April 2014
ER -