Preface

W. P. Dow; K. Kondo; M. Hayase; U. Cvelbar; F. Roozeboom

Preface

W. P. Dow, K. Kondo, M. Hayase, U. Cvelbar, F. Roozeboom

機械航空宇宙工学科

研究成果: Editorial

本文言語	English
ページ（範囲）	3
ページ数	1
ジャーナル	ECS Transactions
巻	92
号	5
出版ステータス	Published - 2019
イベント	International Symposium on Materials and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB 2 - 236th ECS Meeting - Atlanta, United States 継続期間: 13 10月 2019 → 17 10月 2019

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@article{5c8caf7d84f244bd9fefbb05e33ad12d,

title = "Preface",

author = "Dow, {W. P.} and K. Kondo and M. Hayase and U. Cvelbar and F. Roozeboom",

year = "2019",

language = "English",

volume = "92",

pages = "3",

journal = "ECS Transactions",

issn = "1938-5862",

publisher = "Electrochemical Society, Inc.",

number = "5",

note = "International Symposium on Materials and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB 2 - 236th ECS Meeting ; Conference date: 13-10-2019 Through 17-10-2019",

}

TY - JOUR

T1 - Preface

AU - Dow, W. P.

AU - Kondo, K.

AU - Hayase, M.

AU - Cvelbar, U.

AU - Roozeboom, F.

PY - 2019

Y1 - 2019

UR - http://www.scopus.com/inward/record.url?scp=85076965389&partnerID=8YFLogxK

M3 - Editorial

AN - SCOPUS:85076965389

SN - 1938-5862

VL - 92

SP - 3

JO - ECS Transactions

JF - ECS Transactions

IS - 5

T2 - International Symposium on Materials and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB 2 - 236th ECS Meeting

Y2 - 13 October 2019 through 17 October 2019

ER -