抄録
Micro-patterning on non-planar surfaces is required in the packaging and MEMS fields in order to fabricate new micromechanical devices. In this paper, we propose a new patterning process using a 3D photolithography technique for micro-patterning on a non-planar surface. We also report on the fabrication of a 3D photomask for a substrate using the proposed process. The patterning process is based on a twophoton polymerization laser-writing and lift-off process. We confirmed that fine patterns with line widths down to 2 ?m were successfully formed inside the semi-circular trench. In addition, the transfer of the micro-pattern from the 3D photomask to the cylindrical surface of the fiber substrate was confirmed.
| 本文言語 | English |
|---|---|
| ページ(範囲) | 436-441 |
| ページ数 | 6 |
| ジャーナル | Journal of Japan Institute of Electronics Packaging |
| 巻 | 17 |
| 号 | 5 |
| DOI | |
| 出版ステータス | Published - 2014 |