TY - GEN
T1 - Observation of UV nanoimprint lithography process by micro- digitalholographic-PTV
AU - Taniguchi, Jun
AU - Satake, Shin Ichi
AU - Unno, Noriyuki
AU - Kanai, Takahiro
PY - 2010/6/25
Y1 - 2010/6/25
N2 - UV nanoimprint lithography (UV-NIL) is powerful tool of nano-fabrication. This process is simple and quickly pattern transfer method because of room temperature process. Now, in this process sometimes generates the errors about shortage of filling or volume shrinking by photo-curable process. Therefore, observation of UV photo-curable resin behaviors at curing process is important. To observe this phenomenon, micro digital-holographic particle-tracking velocimetry (micro-DHPTV) method was used. This measurement method has submicron three dimensional spatial resolutions and high time-resolution at Newton fluid. The UV photo-curable resin is low viscosity liquid and observation was carried out. In conclusion, curing process of UV photo-curable resin was observed by micro-DHPTV.
AB - UV nanoimprint lithography (UV-NIL) is powerful tool of nano-fabrication. This process is simple and quickly pattern transfer method because of room temperature process. Now, in this process sometimes generates the errors about shortage of filling or volume shrinking by photo-curable process. Therefore, observation of UV photo-curable resin behaviors at curing process is important. To observe this phenomenon, micro digital-holographic particle-tracking velocimetry (micro-DHPTV) method was used. This measurement method has submicron three dimensional spatial resolutions and high time-resolution at Newton fluid. The UV photo-curable resin is low viscosity liquid and observation was carried out. In conclusion, curing process of UV photo-curable resin was observed by micro-DHPTV.
UR - http://www.scopus.com/inward/record.url?scp=77953737317&partnerID=8YFLogxK
U2 - 10.1115/InterPACK2009-89220
DO - 10.1115/InterPACK2009-89220
M3 - Conference contribution
AN - SCOPUS:77953737317
SN - 9780791843598
T3 - Proceedings of the ASME InterPack Conference 2009, IPACK2009
SP - 593
EP - 597
BT - Proceedings of the ASME InterPack Conference 2009, IPACK2009
T2 - 2009 ASME InterPack Conference, IPACK2009
Y2 - 19 July 2009 through 23 July 2009
ER -