TY - GEN
T1 - Novel miniature DMFC with monolithic Si electrodes
AU - Hayase, Masanori
AU - Saito, Yosuke
PY - 2010/6/25
Y1 - 2010/6/25
N2 - A through-chip porous Ru-Pt catalyst layer was fabricated on a Si wafer and a novel miniature DMFC( Direct Methanol Fuel Cell) was realized. Recently, we found that porous noble metal layer can be synthesized on Si substrate by immersion plating on a porous Si. In order to realize a DMFC with our novel structure, a porous Ru layer was synthesized on the Si substrate using the immersion plating on the porous Si, then Pt was deposited by galvanic replacement reaction on the porous Ru. The porous Ru-Pt structure showed catalytic activity on methanol oxidization. A through-chip porous Ru-Pt layer was fabricated on a Si wafer by plasma etching and monolithic electrodes with catalyst layers and fuel channels were realized. A preliminary DMFC prototype successfully demonstrated power generation of 2mW/cm2.
AB - A through-chip porous Ru-Pt catalyst layer was fabricated on a Si wafer and a novel miniature DMFC( Direct Methanol Fuel Cell) was realized. Recently, we found that porous noble metal layer can be synthesized on Si substrate by immersion plating on a porous Si. In order to realize a DMFC with our novel structure, a porous Ru layer was synthesized on the Si substrate using the immersion plating on the porous Si, then Pt was deposited by galvanic replacement reaction on the porous Ru. The porous Ru-Pt structure showed catalytic activity on methanol oxidization. A through-chip porous Ru-Pt layer was fabricated on a Si wafer by plasma etching and monolithic electrodes with catalyst layers and fuel channels were realized. A preliminary DMFC prototype successfully demonstrated power generation of 2mW/cm2.
UR - http://www.scopus.com/inward/record.url?scp=77953784124&partnerID=8YFLogxK
U2 - 10.1115/InterPACK2009-89143
DO - 10.1115/InterPACK2009-89143
M3 - Conference contribution
AN - SCOPUS:77953784124
SN - 9780791843598
T3 - Proceedings of the ASME InterPack Conference 2009, IPACK2009
SP - 459
EP - 462
BT - Proceedings of the ASME InterPack Conference 2009, IPACK2009
T2 - 2009 ASME InterPack Conference, IPACK2009
Y2 - 19 July 2009 through 23 July 2009
ER -