TY - GEN
T1 - Nd-Fe-B Thick-film Magnets on Si Substrates with Al-O Underlayers
AU - Yamaguchi, Haruka
AU - Higuchi, Kota
AU - Kaku, Hibiki
AU - Yamashita, Akihiro
AU - Yanai, Takeshi
AU - Fukunaga, Hirotoshi
AU - Nagai, Keita
AU - Shinshi, Tadahiko
AU - Nakano, Masaki
N1 - Publisher Copyright:
© 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - Although we have prepared Nd-Fe-B thick-films on Si substrates with glass underlayers via pulsed laser deposition (PLD) for micro-magnetization, the glass layers were not suitable for the micro-magnetization due to inhomogeneous structure including voids because of the emission of large particles (droplets). Moreover, the film's squareness of a hysteresis loop deteriorated due to the presence of knick. This paper reports the fabrication of a Al-O film (target: Al2O3) instead of a glass film on a Si substrate. The numbers and size of large particles (droplets) could be reduced in an Al-O film compared with those of a glass film. We also confirmed that the use of an Al-O underlayer enabled us to improve the squareness of a loop.
AB - Although we have prepared Nd-Fe-B thick-films on Si substrates with glass underlayers via pulsed laser deposition (PLD) for micro-magnetization, the glass layers were not suitable for the micro-magnetization due to inhomogeneous structure including voids because of the emission of large particles (droplets). Moreover, the film's squareness of a hysteresis loop deteriorated due to the presence of knick. This paper reports the fabrication of a Al-O film (target: Al2O3) instead of a glass film on a Si substrate. The numbers and size of large particles (droplets) could be reduced in an Al-O film compared with those of a glass film. We also confirmed that the use of an Al-O underlayer enabled us to improve the squareness of a loop.
KW - Al-O underlayer
KW - micro electro mechanical systems
KW - Nd-Fe-B thick-film magnets
KW - pulsed laser deposition
UR - http://www.scopus.com/inward/record.url?scp=85177235099&partnerID=8YFLogxK
U2 - 10.1109/INTERMAGShortPapers58606.2023.10305066
DO - 10.1109/INTERMAGShortPapers58606.2023.10305066
M3 - Conference contribution
AN - SCOPUS:85177235099
T3 - 2023 IEEE International Magnetic Conference - Short Papers, INTERMAG Short Papers 2023 - Proceedings
BT - 2023 IEEE International Magnetic Conference - Short Papers, INTERMAG Short Papers 2023 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2023 IEEE International Magnetic Conference - Short Papers, INTERMAG Short Papers 2023
Y2 - 15 May 2023 through 19 May 2023
ER -