TY - GEN
T1 - Measurement of adhesive force between mold and photo-curable resin in imprint technology
AU - Taniguchi, J.
AU - Kawasaki, T.
AU - Tokano, Y.
AU - Kogo, Y.
AU - Miyamoto, I.
AU - Komuro, M.
AU - Hiroshima, H.
AU - Sakai, N.
AU - Tada, K.
N1 - Publisher Copyright:
© 2001 Japan Soc. Of Applied Physics.
PY - 2001
Y1 - 2001
N2 - Imprint lithography using photocurable resin is the most promising technique compared with other imprint lithography techniques, because it can complete a pattern transfer at room temperature. Thus, it would be able to implement practical mass-production lithography. In a previous report, however, a part of the solidified polymer was ripped away, because of strong adhesive force between the mold and solidified polymer. In order to improve this phenomenon, release coating of quartz mold and development of a photocurable resin are necessary. In this paper, we describe a measurement method of adhesive force between mold and resin using a tensile tester and, furthermore, durability of release coating material.
AB - Imprint lithography using photocurable resin is the most promising technique compared with other imprint lithography techniques, because it can complete a pattern transfer at room temperature. Thus, it would be able to implement practical mass-production lithography. In a previous report, however, a part of the solidified polymer was ripped away, because of strong adhesive force between the mold and solidified polymer. In order to improve this phenomenon, release coating of quartz mold and development of a photocurable resin are necessary. In this paper, we describe a measurement method of adhesive force between mold and resin using a tensile tester and, furthermore, durability of release coating material.
UR - http://www.scopus.com/inward/record.url?scp=84960412219&partnerID=8YFLogxK
U2 - 10.1109/IMNC.2001.984208
DO - 10.1109/IMNC.2001.984208
M3 - Conference contribution
AN - SCOPUS:84960412219
T3 - 2001 International Microprocesses and Nanotechnology Conference, MNC 2001
SP - 300
EP - 301
BT - 2001 International Microprocesses and Nanotechnology Conference, MNC 2001
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - International Microprocesses and Nanotechnology Conference, MNC 2001
Y2 - 31 October 2001 through 2 November 2001
ER -