TY - GEN
T1 - Improvement of imprinted pattern uniformity using sapphire mold
AU - Tokano, Y.
AU - Taniguchi, J.
AU - Kawasaki, T.
AU - Miyamoto, I.
AU - Komuro, M.
AU - Hiroshima, H.
AU - Sakai, N.
AU - Tada, K.
N1 - Publisher Copyright:
© 2001 Japan Soc. Of Applied Physics.
PY - 2001
Y1 - 2001
N2 - Imprint lithography is an attractive technology for LSIs era below 40-nm critical dimension from the viewpoints of high-throughput and low-cost equipment. In order to avoid a pattern placement error due to thermal expansion in the conventional thermal imprint process, we have previously attempted to replicate a mold pattern onto a liquid polymer, which was solidified using ultra-violet (UV) light irradiation at room temperature. The imprint technology based on photo-induced solidification has several advantages such as elimination of heat-up and cool-down time and possibility of step and repeat process. However part of the solidified polymer film was remained on the quartz mold surface. In order to improve this problem, in this article we propose to use a sapphire plate as a mold.
AB - Imprint lithography is an attractive technology for LSIs era below 40-nm critical dimension from the viewpoints of high-throughput and low-cost equipment. In order to avoid a pattern placement error due to thermal expansion in the conventional thermal imprint process, we have previously attempted to replicate a mold pattern onto a liquid polymer, which was solidified using ultra-violet (UV) light irradiation at room temperature. The imprint technology based on photo-induced solidification has several advantages such as elimination of heat-up and cool-down time and possibility of step and repeat process. However part of the solidified polymer film was remained on the quartz mold surface. In order to improve this problem, in this article we propose to use a sapphire plate as a mold.
UR - http://www.scopus.com/inward/record.url?scp=84960373441&partnerID=8YFLogxK
U2 - 10.1109/IMNC.2001.984153
DO - 10.1109/IMNC.2001.984153
M3 - Conference contribution
AN - SCOPUS:84960373441
T3 - 2001 International Microprocesses and Nanotechnology Conference, MNC 2001
SP - 188
EP - 189
BT - 2001 International Microprocesses and Nanotechnology Conference, MNC 2001
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - International Microprocesses and Nanotechnology Conference, MNC 2001
Y2 - 31 October 2001 through 2 November 2001
ER -