Development of three-dimensional motion measuring device for the human ankle joint by using parallel link mechanism

Teru Yonezawa, Takayuki Onodera, Ming Ding, Hiroshi Mizoguchi, Hiroshi Takemura, Takeki Ogitsu

研究成果: Conference contribution査読

4 被引用数 (Scopus)

抄録

This paper presents a novel ankle motion measuring device that can measure three-dimensional motions without a motion capture system (MCS). We adapted a parallel link mechanism for the device using six wire-type displacement sensors to measure the ankle joint motions in six degrees of freedom (six-DOF). We define the motions of a foot plate which is attached to a foot sole as ankle joint motions. A posture of the foot plate, i.e., the three-dimensional position (x, y, z) and rotation angle (Ø, eę, y/), is numerically calculated by solving the forward kinematics of the developed device. We conducted performance verification experiments of the developed device by comparing these results with those of the MCS. The experimental results show that the maximum root mean square error of the three-dimensional position and rotation angle measured by the developed device are 2.6 mm and 1.5°, respectively. This measuring performance of the developed device indicates that the ankle motion measuring device is accurate and valid. Moreover, this device enables physical therapists to easily measure ankle motions with an accuracy as high as that of an MCS.

本文言語English
ホスト出版物のタイトル2014 36th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2014
出版社Institute of Electrical and Electronics Engineers Inc.
ページ4358-4361
ページ数4
ISBN(電子版)9781424479290
DOI
出版ステータスPublished - 2 11月 2014
イベント2014 36th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2014 - Chicago, United States
継続期間: 26 8月 201430 8月 2014

出版物シリーズ

名前2014 36th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2014

Conference

Conference2014 36th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2014
国/地域United States
CityChicago
Period26/08/1430/08/14

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