Development of Au/Pt/Ti multilayers for wafer-level packaging and residual gas gettering

Keyphrases

• Annealing 66%
• Au Surface 33%
• AuPt 100%
• Bonding Layer 33%
• Degassing 33%
• Getter 33%
• Gettering 100%
• Hermetic Sealing 33%
• Internal Surface 33%
• Metal multilayers 33%
• Packaging Technique 33%
• Residual Gas 100%
• Sealing Process 33%
• Ti Interlayer 33%
• Ti Layer 33%
• Vacuum Sealing 33%
• Wafer-level Packaging 100%

Engineering

• Bonding Layer 50%
• Getters 50%
• Internal Surface 50%
• Level Packaging 100%
• Residual Gas 100%
• Simplifies 50%

Material Science

• Annealing 50%
• Gettering 100%
• Surface (Surface Science) 50%