Development of Au/Pt/Ti multilayers for wafer-level packaging and residual gas gettering

S. Kariya, T. Matsumae, Y. Kurashima, H. Takagi, M. Hayase, E. Higurashi

研究成果: Conference contribution査読

2 被引用数 (Scopus)

抄録

We demonstrated that Au/Pt/Ti (from top to bottom) metal multilayers enables wafer-level packaging of degassed assemblies and residual gas gettering. A hermetic sealing was fabricated by Au surfaces after degassing annealing at 200°C. In addition, the Ti underlayer atoms diffused to the internal surface by annealing at 450°C, enabling the gas in the package. As the Au/Pt/Ti layers have the functions of the bonding layer and gas getter, the proposed packaging technique can potentially simplify a vacuum sealing process.

本文言語English
ホスト出版物のタイトル2021 International Conference on Electronics Packaging, ICEP 2021
出版社Institute of Electrical and Electronics Engineers Inc.
ページ69-70
ページ数2
ISBN(電子版)9784991191114
DOI
出版ステータスPublished - 12 5月 2021
イベント20th International Conference on Electronics Packaging, ICEP 2021 - Tokyo, Japan
継続期間: 12 5月 202114 5月 2021

出版物シリーズ

名前2021 International Conference on Electronics Packaging, ICEP 2021

Conference

Conference20th International Conference on Electronics Packaging, ICEP 2021
国/地域Japan
CityTokyo
Period12/05/2114/05/21

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