Development of a fast atom beam gun for surface-activated bonding

Ryo Morisaki; Yuuki Hirai; Chiemi Oka; Mizue Mizoshiri; Takahiro Yamazaki; Junpei Sakurai; Takami Hirai; Tomonori Takahashi; Hiroyuki Tsuji; Seiichi Hata

doi:10.1016/j.precisioneng.2019.11.006

Development of a fast atom beam gun for surface-activated bonding

Ryo Morisaki, Yuuki Hirai, Chiemi Oka, Mizue Mizoshiri, Takahiro Yamazaki, Junpei Sakurai, Takami Hirai, Tomonori Takahashi, Hiroyuki Tsuji, Seiichi Hata

総合研究院

研究成果: Article › 査読

3 被引用数 (Scopus)

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Surface-activated bonding (SAB), also called room-temperature bonding, is used in three-dimensional integration technology for semiconductor devices. An Ar fast atom beam (FAB) is used for SAB. However, conventional FAB guns must be replaced after hundreds of minutes of irradiation because carbon abrasion powders are generated by Ar ions sputtering in the gun. Therefore, this study develops a novel FAB gun with improved lifetime. The proposed FAB gun applies magnetic fields to guide Ar ions to reduce sputtering in the gun and improve irradiation efficiency. The proposed FAB gun indicates the possibility of improving gun lifetime.

本文言語	English
ページ（範囲）	106-112
ページ数	7
ジャーナル	Precision Engineering
巻	62
DOI	https://doi.org/10.1016/j.precisioneng.2019.11.006
出版ステータス	Published - 3月 2020

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10.1016/j.precisioneng.2019.11.006

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title = "Development of a fast atom beam gun for surface-activated bonding",

abstract = "Surface-activated bonding (SAB), also called room-temperature bonding, is used in three-dimensional integration technology for semiconductor devices. An Ar fast atom beam (FAB) is used for SAB. However, conventional FAB guns must be replaced after hundreds of minutes of irradiation because carbon abrasion powders are generated by Ar ions sputtering in the gun. Therefore, this study develops a novel FAB gun with improved lifetime. The proposed FAB gun applies magnetic fields to guide Ar ions to reduce sputtering in the gun and improve irradiation efficiency. The proposed FAB gun indicates the possibility of improving gun lifetime.",

keywords = "Ar plasma, Fast atom beam (FAB), Room-temperature bonding, Sputter, Surface acoustic wave (SAW) filter, Surface-activated bonding (SAB)",

author = "Ryo Morisaki and Yuuki Hirai and Chiemi Oka and Mizue Mizoshiri and Takahiro Yamazaki and Junpei Sakurai and Takami Hirai and Tomonori Takahashi and Hiroyuki Tsuji and Seiichi Hata",

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year = "2020",

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doi = "10.1016/j.precisioneng.2019.11.006",

language = "English",

volume = "62",

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T1 - Development of a fast atom beam gun for surface-activated bonding

AU - Morisaki, Ryo

AU - Hirai, Yuuki

AU - Oka, Chiemi

AU - Mizoshiri, Mizue

AU - Yamazaki, Takahiro

AU - Sakurai, Junpei

AU - Hirai, Takami

AU - Takahashi, Tomonori

AU - Tsuji, Hiroyuki

AU - Hata, Seiichi

PY - 2020/3

Y1 - 2020/3

N2 - Surface-activated bonding (SAB), also called room-temperature bonding, is used in three-dimensional integration technology for semiconductor devices. An Ar fast atom beam (FAB) is used for SAB. However, conventional FAB guns must be replaced after hundreds of minutes of irradiation because carbon abrasion powders are generated by Ar ions sputtering in the gun. Therefore, this study develops a novel FAB gun with improved lifetime. The proposed FAB gun applies magnetic fields to guide Ar ions to reduce sputtering in the gun and improve irradiation efficiency. The proposed FAB gun indicates the possibility of improving gun lifetime.

AB - Surface-activated bonding (SAB), also called room-temperature bonding, is used in three-dimensional integration technology for semiconductor devices. An Ar fast atom beam (FAB) is used for SAB. However, conventional FAB guns must be replaced after hundreds of minutes of irradiation because carbon abrasion powders are generated by Ar ions sputtering in the gun. Therefore, this study develops a novel FAB gun with improved lifetime. The proposed FAB gun applies magnetic fields to guide Ar ions to reduce sputtering in the gun and improve irradiation efficiency. The proposed FAB gun indicates the possibility of improving gun lifetime.

KW - Ar plasma

KW - Fast atom beam (FAB)

KW - Room-temperature bonding

KW - Sputter

KW - Surface acoustic wave (SAW) filter

KW - Surface-activated bonding (SAB)

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U2 - 10.1016/j.precisioneng.2019.11.006

DO - 10.1016/j.precisioneng.2019.11.006

M3 - Article

AN - SCOPUS:85075578251

SN - 0141-6359

VL - 62

SP - 106

EP - 112

JO - Precision Engineering

JF - Precision Engineering

ER -

Development of a fast atom beam gun for surface-activated bonding

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