Development and process optimization of C2W self-alignment & temporary bonding system

Yuta Nakano, Jian Lu, Hideki Takagi, Masanori Hayase, Ryutaro Maeda

研究成果: Conference contribution査読

抄録

Size-free MEMS-IC integration is important for MEMS ubiquitous applications as well as to reduce its production cost. In our previous work, we have proposed a 2-step approach for MEMS-IC integration by using chip to wafer (C2W) self-alignment and temporary bonding, and then wafer level permanent bonding. In this work, a prototype system for C2W self-alignment and temporary bonding was developed, and the process parameters, e.g. volume of H2O, wafer temperature, and annealing process, were studied and optimized for better success-ratio and system performance. The results presented in this paper revealed that the proposed system is practically applicable to size-free MEMS-IC integration with reasonably high efficiency.

本文言語English
ホスト出版物のタイトル2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013
出版ステータスPublished - 2 9月 2013
イベント2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013 - Barcelona, Spain
継続期間: 16 4月 201318 4月 2013

出版物シリーズ

名前2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013

Conference

Conference2013 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2013
国/地域Spain
CityBarcelona
Period16/04/1318/04/13

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