Bonding formation and gas absorption using Au/Pt/Ti layers for vacuum packaging

Shingo Kariya, Takashi Matsumae, Yuichi Kurashima, Hideki Takagi, Masanori Hayase, Eiji Higurashi

研究成果: Article査読

2 被引用数 (Scopus)

抄録

In this study, we developed a metal multilayer that can provide hermetic sealing after degassing the assemblies and absorbing the residual gases in the package. A package without a leak path was obtained by the direct bonding of the Au/Pt/Ti layers. After packaging, annealing at 450 °C caused thermal diffusion of the Ti underlayer atoms to the inner surface, which led to absorption of the residual gas molecules. These results indicated that a wafer coated with a Au/Pt/Ti layer can provide hermetic sealing and absorb residual gases, which can simplify vacuum packaging processes in the electronics industry.

本文言語English
論文番号2
ジャーナルMicrosystems and Nanoengineering
8
1
DOI
出版ステータスPublished - 12月 2022

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