Ikuma, Y.,
Yamamoto, T.,
Mizuno, M.,
Ohmiya, Y.,
Koshiji, K.,
Shimizu, Y. &
Shimizu, T.,
12 5月 2021,
2021 International Conference on Electronics Packaging, ICEP 2021. Institute of Electrical and Electronics Engineers Inc.,
p. 83-84 2 p. 9451940. (2021 International Conference on Electronics Packaging, ICEP 2021).
研究成果: Conference contribution › 査読