Yanagisawa, N., Matsumae, T.,
Hayase, M., Kurashima, Y. & Takagi, H.,
2026,
2026 9th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2026. Institute of Electrical and Electronics Engineers Inc.,
p. 14P11 (2026 9th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2026).
研究成果: Conference contribution › 査読