経営学研究科

Keyphrases

1. Power Dissipation 64%
2. Access Time 61%
3. Process Technology 51%
4. Self-aligned Process 51%
5. Schottky Diode 46%
6. Japan 41%
7. Time Division 38%
8. Self-aligned 35%
9. Time-division Switching 35%
10. Diode 25%
11. Am(III) 23%
12. Switched Systems 23%
13. High-speed Circuit Design 23%
14. Metallization 23%
15. High-speed Digital System 23%
16. Transistor 23%
17. Circuit Design 23%
18. Low Voltage Swing 20%
19. Si Substrate 19%
20. Soluble Suppression of Tumorigenicity 2 (sST2) 19%
21. Fabrication Methods 19%
22. Deregulation 15%
23. Distribution System 15%
24. Excellent Performance 15%
25. 2D-FFT 15%
26. Negative Resistance 15%
27. Particulate Measurements 15%
28. High Current Density 15%
29. High Bandwidth Memory 15%
30. Trade Practices 15%
31. Diode Characteristics 15%
32. Clock Time 15%
33. Density Region 15%
34. MoSi2 15%
35. Continuous Innovation 15%
36. Petroleum Industry 15%
37. Innovation Patterns 15%
38. Knowledge Creating 15%
39. Tacit Knowledge 15%
40. Single chip Processor 15%
41. Logic ICs 15%
42. High-speed Logic 15%
43. Circuit Techniques 15%
44. N-of-1 15%
45. Differential Circuit 15%
46. Impurities 15%
47. Two-dimensional FFT 15%
48. System Structure 15%
49. Emitter Width 15%
50. Cut-off Frequency 15%
51. System Application 15%
52. Epitaxial 15%
53. Si Electrode 15%
54. Reconstructed Image 15%
55. High-speed Performance 15%
56. Switching Structure 12%
57. Polysilicon 11%
58. Schottky 11%
59. Silicide Layer 11%
60. Ultra-high Speed 10%
61. Rebirth 7%
62. Memory Cell 7%
63. Resistivity 7%
64. Reconstruction Process 7%
65. Corporate System 7%
66. Second Range 7%
67. Proper Time 7%
68. Scanning Device 7%
69. Time Margin 7%
70. Heat Treatment 7%
71. Financial System 7%
72. Minority Carriers 7%
73. Spatial Distribution 7%
74. Online Sensors 7%
75. Carrier Accumulation 7%
76. Automatic Measurement 7%
77. Fraunhofer 7%
78. Small Area 7%
79. Real Image 7%
80. Reading Methods 7%
81. W-value 7%
82. Density Condition 7%
83. Sensor Scanning 7%
84. Light Intensity Distribution 7%
85. Focusing Parameter 7%
86. Fast Reading 7%
87. Bias Current 7%
88. Electric Power Industry 7%
89. Slow Writing 7%
90. Japanese Companies 7%
91. Molybdenum Silicides 7%
92. Al Contacts 7%
93. Management Practices 7%
94. FFT Processor 7%
95. Machine Cycle 7%
96. Semiconductors 7%
97. VLSI Architecture 7%
98. Chip Size 7%
99. Design Rules 7%
100. Video Processing 7%

Engineering

1. Reliability Availability and Maintainability (Reliability Engineering) 100%
2. Energy Dissipation 55%
3. Circuit Design 48%
4. Access Time 41%
5. TV 30%
6. Switching Systems 23%
7. Digital Systems 20%
8. Metallizations 17%
9. Two Dimensional 15%
10. Speed Memory 15%
11. Transistor Transistor Logic Circuits 15%
12. Single Chip 15%
13. Si Substrate 15%
14. Resistance Characteristic 15%
15. High Current Density 15%
16. Limit Cycle 15%
17. Reconstructed Image 15%
18. Digital Video 15%
19. Petroleum Industry 15%
20. Japan 15%
21. High Speed Circuit 12%
22. Cutoff Frequency 12%
23. Fabrication Method 10%
24. Speech Data 7%
25. Proper Time 7%
26. Communication System 7%
27. Barrier Height 7%
28. Floating Point Processor 7%
29. Bit Floating Point 7%
30. Video Processing 7%
31. Channel Capacity 7%
32. Switching Network 7%
33. Systems Performance 7%
34. Speech Processing 7%
35. Schottky Barrier 7%
36. Minority Carriers 7%
37. Real Image 7%
38. Dynamic Range 7%
39. Focal Point 7%
40. Luminous Intensity 7%
41. Spatial Distribution 7%
42. Silicon Electrode 5%
43. Ion Implantation 5%
44. Joints (Structural Components) 5%
45. Series Resistance 5%
46. Arsenic 5%
47. Design Condition 5%
48. Design Rule 5%