Three-dimensional measurement of near-wall velocity in millimeter channel by a single view imaging

Yoshiyasu Ichikawa, Kojiro Nishiwake, Hiromu Wakayama, Yuki Kameya, Makoto Yamamoto, Masahiro Motosuke

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Citations (Scopus)

Abstract

It is well known that there is a strong correlation between heat transfer and near-wall flow. It is important to obtain the detailed near-wall flow field, but it has a lot of difficulties to measure near-wall region by traditional approaches for example hot wire anemometry and particle image velocimetry (PIV). The purpose of this study is to determine the three-dimensional velocity field at near-wall area in micron resolution by the astigmatism particle tracking velocimetry (APTV). In this study, an estimation of depth location of tracer particles by applying a specialized imaging optics controlling the astigmatism [1] was employed. We have developed a measurement system to get the particle location within 15 μm from wall using a long-working-distance microscope with astigmatic optics. As a proof-of-concept, near-wall velocity field in a millimeter-ordered parallel plate channel was measured with low Reynolds numbers (Re=1 ∼ 5) Poiseuille flow to confirm the validity of it. As a result, we can obtain the near-wall velocity within 15 μm from the wall precisely. From the velocity distribution, the standard deviation of the velocity at each location was calculated and the dispersion of velocity was evaluated. As a result, it was confirmed that the measurement was carried out more accurately in high-speed area. Comparison of the measured velocity distribution with a theoretical calculation and micro-PIV results were also done. From these velocity distributions, the wall shear stress on the wall was determined.

Original languageEnglish
Title of host publicationASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2015, collocated with the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
PublisherAmerican Society of Mechanical Engineers
ISBN (Electronic)9780791856871
DOIs
Publication statusPublished - 2015
EventASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2015, collocated with the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - San Francisco, United States
Duration: 6 Jul 20159 Jul 2015

Publication series

NameASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2015, collocated with the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

Conference

ConferenceASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels, ICNMM 2015, collocated with the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
Country/TerritoryUnited States
CitySan Francisco
Period6/07/159/07/15

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