Thermal Modelling of IPT Coil Embedded in Resin for the Roadway

Naoya Sasa, Takahiro Yamahara, Seho Kim, Takehiro Imura, Grant Covic, Yoichi Hori, Hiroyuki Mashito, Hiroki Tanaka

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Citation (Scopus)

Abstract

This paper presents an investigation into the thermal behaviour of a copper coil embedded into a block of resin that is bound to the asphalt in the roadway. The roadway is made up of three layers of 50mm asphalt and the resin block surrounding the coil was placed within the surface layer. The thermal behaviour of the coil and the surrounding environment is presented when the coil is energised at 90A DC to be within the electromagnetic radiation limits. Based on the exerpimental results, simulations are conducted in ANSYS Maxwell and Icepak to predict the temperature rise using AC energisation at 85kHz. The coil is energised in the simulation with a range of currents to predict the thermal stress the resin block will withstand at steady-state conditions. The simulation findings predict the thermal behaviour of the resin block and the surrounding asphalt when the coil is transferring 10kW.

Original languageEnglish
Title of host publicationProceedings of 2024 IEEE Wireless Power Technology Conference and Expo, WPTCE 2024
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages165-168
Number of pages4
ISBN (Electronic)9798350349139
DOIs
Publication statusPublished - 2024
Event2024 IEEE Wireless Power Technology Conference and Expo, WPTCE 2024 - Kyoto, Japan
Duration: 8 May 202411 May 2024

Publication series

NameProceedings of 2024 IEEE Wireless Power Technology Conference and Expo, WPTCE 2024

Conference

Conference2024 IEEE Wireless Power Technology Conference and Expo, WPTCE 2024
Country/TerritoryJapan
CityKyoto
Period8/05/2411/05/24

Keywords

  • inductive power transfer
  • thermal analysis
  • wireless power transfer

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