TY - JOUR
T1 - Silver pattern transfer technique using concave region of mold and silver ink
AU - Enomoto, Keisuke
AU - Taniguchi, Jun
N1 - Publisher Copyright:
© 2023 The Japan Society of Applied Physics
PY - 2023/6/1
Y1 - 2023/6/1
N2 - In this study, we performed two-tone transfer using silver ink by the nano-transfer printing process, which does not involve a vacuum deposition step. To achieve a two-tone transfer, it is necessary to separate the metal film from the top surface of the mold and the metal part at the bottom of the hole. However, in the case of silver ink, the hole is often completely filled, therefore, separation between the top surface and the bottom of the hole is difficult. We performed spin coating to thin out the silver ink in the mold, confirmed that the silver ink can be separated at the top and bottom of the mold by baking, and investigated the relationship between the number of spin coating revolutions and the pattern success rate. The success rate for scooping the bottom silver from the 2 cm × 2 cm line-and-space mold was ∼85%.
AB - In this study, we performed two-tone transfer using silver ink by the nano-transfer printing process, which does not involve a vacuum deposition step. To achieve a two-tone transfer, it is necessary to separate the metal film from the top surface of the mold and the metal part at the bottom of the hole. However, in the case of silver ink, the hole is often completely filled, therefore, separation between the top surface and the bottom of the hole is difficult. We performed spin coating to thin out the silver ink in the mold, confirmed that the silver ink can be separated at the top and bottom of the mold by baking, and investigated the relationship between the number of spin coating revolutions and the pattern success rate. The success rate for scooping the bottom silver from the 2 cm × 2 cm line-and-space mold was ∼85%.
KW - UV-NIL
KW - metamaterials
KW - nanoimprint
KW - silver ink
KW - spin-coating
KW - transparent conductive electrodes
KW - two-tone
UR - http://www.scopus.com/inward/record.url?scp=85148952824&partnerID=8YFLogxK
U2 - 10.35848/1347-4065/acb77f
DO - 10.35848/1347-4065/acb77f
M3 - Article
AN - SCOPUS:85148952824
SN - 0021-4922
VL - 62
JO - Japanese Journal of Applied Physics
JF - Japanese Journal of Applied Physics
IS - SG
M1 - SG1011
ER -