Photoresist materials comprising photobase generators and epoxy resins bearing carboxylic acids to lead to marked enhancement of base-catalyzed cross-linking reactions

Kiwamu Terada, Masahiro Furutani, Koji Arimitsu

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)

Abstract

Most of the photopatterning materials based on epoxy resins utilize photoacid generators (PAGs), which generate superacids as catalysts. They have been used for high aspect ratio photoresists in the fabrication of MEMS devices. However, there is a drawback, in that the acidic species from PAGs will induce metal corrosion. One of the approaches to overcome this problem is the use of photobase generators (PBGs) because organic bases would induce no corrosion. Although there have been many previous investigations of PBGs, only a few articles have mentioned photoreactive materials relying on PBGs because of their low photosensitivity. We report here highly sensitive photopatterning materials comprising PBGs and an epoxy resin bearing carboxylic acid groups. As a result, the photopatterning materials showed higher photosensitivity than conventional epoxy resin systems. We obtained high-photosensitivity (up to 900 mJ/cm2), high-resolution (10-μm line-and-space) patterning materials in films, 10 μm in thickness.

Original languageEnglish
Pages (from-to)304-311
Number of pages8
JournalPolymers for Advanced Technologies
Volume30
Issue number2
DOIs
Publication statusPublished - 1 Feb 2019

Keywords

  • base amplifier
  • base-catalyzed reaction
  • cross-linking reaction
  • epoxy resin
  • photobase generator

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