we prepared five kinds of photo-curable resins, and conducted evaluation experiments for their thermal properties, mechanical roperties, and application availability for the imprint process. Measurements of thermal properties using the TG method, TM-DSC method, and laser interferometric method were studied. From these measurements, it was found that the measurements of the thermally stable temperature, glass-transition temperature, and linear expansion coefficient of the resins were possible. Also, measurements of mechanical properties using the nano indentation were studied. In this method, the measurements of Young's modulus of the thin resin film on the substrate were possible. With respect to application availability for the imprint process, we investigated effects of the mold release treatment and their durability for two kinds of resins by measuring their adhesive force. It was observed that the difference in durability of mold release treatment effects depends on the resin type.
|Number of pages||5|
|Journal||IEEJ Transactions on Electronics, Information and Systems|
|Publication status||Published - 1 Jan 2007|
- Adhesive force
- Glass-transition temperature
- Photo-curable resin