Numerical analysis of dimple fracture process under different constraint conditions

Masanori Kikuchi, Akiyuki Takahashi

Research output: Contribution to journalConference articlepeer-review


Three kinds of fracture specimens are tested under different constraint conditions. One is 3PB (3 Point Bending) specimen, another is CCT (Center Cracked Tension) specimen, and the third one is called CCB (Center Cracked Bending) specimen. By the SEM (Scanning Electron Microscope) observation, it is shown that the roughness of fracture surface is different from each other largely. The number of large voids and the average diameter of them are also different from each other. They are the effect of constraint condition. The dimple fracture process is simulated by the finite element method. By the finite element analyses, the crack tip stress fields are obtained. The distribution pattern of the high stress triaxiality area agrees with the fracture surface roughness qualitatively. The distribution of the void volume fraction also agrees with the experimental data. The macroscopic parameter, J integral, is also evaluated and the constraint effect on the critical value of J is discussed.

Original languageEnglish
JournalKey Engineering Materials
Publication statusPublished - 1 Jan 2000
Event4th International Conference on Fracture and Strength of Solids - Pohang, South Korea
Duration: 16 Aug 200018 Aug 2000


Dive into the research topics of 'Numerical analysis of dimple fracture process under different constraint conditions'. Together they form a unique fingerprint.

Cite this