Molecular Dynamics Simulation of Cumulative Microscopic Damage in a Thermosetting Polymer under Cyclic Loading

Keyphrases

• 4,4′-Diaminodiphenyl Sulfone 25%
• All-atom Molecular Dynamics Simulation 25%
• Applied Load 25%
• Bisphenol A 25%
• Bisphenol A Diglycidyl Ether (BADGE) 25%
• Bond Dissociation 100%
• Composite Materials 25%
• Covalent Bond 100%
• Cross-linked Polymer 25%
• Cross-linked Structure 25%
• Cyclic Loading 100%
• Cyclic Loading Test 25%
• Degradation Process 50%
• Distance Criterion 25%
• Entropy Generation 50%
• High Entropy 25%
• Inelasticity 50%
• Interatomic Distance 25%
• Material Degradation 25%
• Mechanical Properties 25%
• Microscopic Damage 100%
• Molecular Dynamics Simulation 100%
• Nonlinear Behavior 25%
• Precise Prediction 25%
• Stress-strain Curve 50%
• Thermosetting Polymers 100%
• Thermosetting Resin 25%
• Void Growth 50%

Engineering

• Applied Load 25%
• Bisphenol 25%
• Composite Material 25%
• Covalent 100%
• Cross-Linked Polymer 25%
• Cyclic Loading 100%
• Degradation Process 50%
• Durables 25%
• Entropy Generation 50%
• Materials Degradation 25%
• Microscale 25%
• Nanoscale 50%
• Void Growth 50%

Material Science

• Composite Material 25%
• Covalent Bond 100%
• Materials Degradation 25%
• Thermoset Plastics 100%
• Thermosetting Resin 25%
• Void Growth 50%