Integration of linear thermoelectric modules composed of low and intermediate temperature P- and N-type metallic semiconductors into combustion chamber walls

M. Taya; H. S. Kim; T. Ito; T. Iida

Integration of linear thermoelectric modules composed of low and intermediate temperature P- and N-type metallic semiconductors into combustion chamber walls

M. Taya, H. S. Kim, T. Ito, T. Iida

Department of Materials Science and Technology

Research output: Contribution to conference › Paper › peer-review

Original language	English
Pages	1788-1789
Number of pages	2
Publication status	Published - 2013
Event	19th International Conference on Composite Materials, ICCM 2013 - Montreal, Canada Duration: 28 Jul 2013 → 2 Aug 2013

Conference

Conference	19th International Conference on Composite Materials, ICCM 2013
Country/Territory	Canada
City	Montreal
Period	28/07/13 → 2/08/13

Keywords

Higher specific TE power
Integration with fe-SMA shrink-fit-joining
Linear TE module
Mg2Si
MnSi

Cite this

@conference{3f29ce0037134939af03a1d5dde71ebd,

title = "Integration of linear thermoelectric modules composed of low and intermediate temperature P- and N-type metallic semiconductors into combustion chamber walls",

keywords = "Higher specific TE power, Integration with fe-SMA shrink-fit-joining, Linear TE module, Mg2Si, MnSi",

author = "M. Taya and Kim, {H. S.} and T. Ito and T. Iida",

note = "Funding Information: This work was supported by AFOSR Grants to University of Washington , AFOSR-MURI (F95550-06-01-0326) and AFOSR DURIP (FA9550-09-1-0587) where Dr. Les Lee is the program manager.; 19th International Conference on Composite Materials, ICCM 2013 ; Conference date: 28-07-2013 Through 02-08-2013",

year = "2013",

language = "English",

pages = "1788--1789",

}

Integration of linear thermoelectric modules composed of low and intermediate temperature P- and N-type metallic semiconductors into combustion chamber walls. / Taya, M.; Kim, H. S.; Ito, T. et al.
2013. 1788-1789 Paper presented at 19th International Conference on Composite Materials, ICCM 2013, Montreal, Canada.

Research output: Contribution to conference › Paper › peer-review

TY - CONF

T1 - Integration of linear thermoelectric modules composed of low and intermediate temperature P- and N-type metallic semiconductors into combustion chamber walls

AU - Taya, M.

AU - Kim, H. S.

AU - Ito, T.

AU - Iida, T.

N1 - Funding Information: This work was supported by AFOSR Grants to University of Washington , AFOSR-MURI (F95550-06-01-0326) and AFOSR DURIP (FA9550-09-1-0587) where Dr. Les Lee is the program manager.

PY - 2013

Y1 - 2013

KW - Higher specific TE power

KW - Integration with fe-SMA shrink-fit-joining

KW - Linear TE module

KW - Mg2Si

KW - MnSi

UR - http://www.scopus.com/inward/record.url?scp=85053197053&partnerID=8YFLogxK

M3 - Paper

AN - SCOPUS:85053197053

SP - 1788

EP - 1789

T2 - 19th International Conference on Composite Materials, ICCM 2013

Y2 - 28 July 2013 through 2 August 2013

ER -

Integration of linear thermoelectric modules composed of low and intermediate temperature P- and N-type metallic semiconductors into combustion chamber walls

Conference

Keywords

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Cite this