@inproceedings{1cfd04beb98a4c7094c2a178f7a84681,
title = "Direct bonding of germanium and diamond substrates by hydrophilic bonding",
abstract = "Germanium (Ge) is attracting attention as a high-frequency device material, but its low thermal conductivity causes a heat dissipation problem. To overcome this drawback, we demonstrate the direct bonding of the Ge substrate with a diamond heat-dissipating substrate, which has the highest thermal conductivity among solids. The Ge substrate was activated by oxygen plasma, and the diamond substrate was washed with a mixture of NH3/H2O2, and then the two substrates were brought into contact with each other. The substrates were then heated at 200°C for 2 hours with a bond load of 3 MPa. The above process resulted in the direct bonding of the Ge and diamond substrates. This direct bonding improves the heat dissipation of Ge devices, which will contribute to next-generation high-speed devices.",
keywords = "diamond, direct bonding, germanium, hydrophilic bonding, oxygen plasma",
author = "Yuki Minowa and Takashi Matsumae and Masanori Hayase and Yuichi Kurashima and Hideki Takagi",
note = "Publisher Copyright: {\textcopyright} 2023 Japan Institute of Electronics Packaging.; 22nd International Conference on Electronics Packaging, ICEP 2023 ; Conference date: 19-04-2023 Through 22-04-2023",
year = "2023",
doi = "10.23919/ICEP58572.2023.10129744",
language = "English",
series = "2023 International Conference on Electronics Packaging, ICEP 2023",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "171--172",
booktitle = "2023 International Conference on Electronics Packaging, ICEP 2023",
}