Development of multi-axis high-precision stage using multistep wireless power transfer

Yuma Yazaki; Wataru Ohnishi; Takehiro Imura; Hiroshi Fujimoto; Koichi Sakata; Atushi Hara; Zhaoxiang Chen; Kazuhiro Yokoyama; Kazuhiro Suzuki

doi:10.1109/IECON.2018.8591153

Development of multi-axis high-precision stage using multistep wireless power transfer

Yuma Yazaki, Wataru Ohnishi, Takehiro Imura, Hiroshi Fujimoto, Koichi Sakata, Atushi Hara, Zhaoxiang Chen, Kazuhiro Yokoyama, Kazuhiro Suzuki

Department of Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Citation (Scopus)

Abstract

The most critical problem in high-precision stages for semiconductor and LCD manufacturing is cable disturbance, which can be caused by power cables and communication lines. In our previous study, we designed a novel single-axis high-precision stage using wireless power transfer technology, which avoids cable disturbance. Here, we further develop this concept and propose a multi-axis wireless high-precision. Experimental results demonstrate the effectiveness of the multi-axis wireless high-precision stage.

Original language	English
Title of host publication	Proceedings
Subtitle of host publication	IECON 2018 - 44th Annual Conference of the IEEE Industrial Electronics Society
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	4799-4804
Number of pages	6
ISBN (Electronic)	9781509066841
DOIs	https://doi.org/10.1109/IECON.2018.8591153
Publication status	Published - 26 Dec 2018
Event	44th Annual Conference of the IEEE Industrial Electronics Society, IECON 2018 - Washington, United States Duration: 20 Oct 2018 → 23 Oct 2018

Publication series

Name	Proceedings: IECON 2018 - 44th Annual Conference of the IEEE Industrial Electronics Society

Conference

Conference	44th Annual Conference of the IEEE Industrial Electronics Society, IECON 2018
Country/Territory	United States
City	Washington
Period	20/10/18 → 23/10/18

Access to Document

10.1109/IECON.2018.8591153

Cite this

Yazaki, Y., Ohnishi, W., Imura, T., Fujimoto, H., Sakata, K., Hara, A., Chen, Z., Yokoyama, K., & Suzuki, K. (2018). Development of multi-axis high-precision stage using multistep wireless power transfer. In Proceedings: IECON 2018 - 44th Annual Conference of the IEEE Industrial Electronics Society (pp. 4799-4804). Article 8591153 (Proceedings: IECON 2018 - 44th Annual Conference of the IEEE Industrial Electronics Society). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IECON.2018.8591153

Yazaki, Yuma ; Ohnishi, Wataru ; Imura, Takehiro et al. / Development of multi-axis high-precision stage using multistep wireless power transfer. Proceedings: IECON 2018 - 44th Annual Conference of the IEEE Industrial Electronics Society. Institute of Electrical and Electronics Engineers Inc., 2018. pp. 4799-4804 (Proceedings: IECON 2018 - 44th Annual Conference of the IEEE Industrial Electronics Society).

@inproceedings{a144df83f2ca4e128f33577825fd786f,

title = "Development of multi-axis high-precision stage using multistep wireless power transfer",

abstract = "The most critical problem in high-precision stages for semiconductor and LCD manufacturing is cable disturbance, which can be caused by power cables and communication lines. In our previous study, we designed a novel single-axis high-precision stage using wireless power transfer technology, which avoids cable disturbance. Here, we further develop this concept and propose a multi-axis wireless high-precision. Experimental results demonstrate the effectiveness of the multi-axis wireless high-precision stage.",

author = "Yuma Yazaki and Wataru Ohnishi and Takehiro Imura and Hiroshi Fujimoto and Koichi Sakata and Atushi Hara and Zhaoxiang Chen and Kazuhiro Yokoyama and Kazuhiro Suzuki",

note = "Publisher Copyright: {\textcopyright} 2018 IEEE.; 44th Annual Conference of the IEEE Industrial Electronics Society, IECON 2018 ; Conference date: 20-10-2018 Through 23-10-2018",

year = "2018",

month = dec,

day = "26",

doi = "10.1109/IECON.2018.8591153",

language = "English",

series = "Proceedings: IECON 2018 - 44th Annual Conference of the IEEE Industrial Electronics Society",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "4799--4804",

booktitle = "Proceedings",

}

Yazaki, Y, Ohnishi, W, Imura, T, Fujimoto, H, Sakata, K, Hara, A, Chen, Z, Yokoyama, K & Suzuki, K 2018, Development of multi-axis high-precision stage using multistep wireless power transfer. in Proceedings: IECON 2018 - 44th Annual Conference of the IEEE Industrial Electronics Society., 8591153, Proceedings: IECON 2018 - 44th Annual Conference of the IEEE Industrial Electronics Society, Institute of Electrical and Electronics Engineers Inc., pp. 4799-4804, 44th Annual Conference of the IEEE Industrial Electronics Society, IECON 2018, Washington, United States, 20/10/18. https://doi.org/10.1109/IECON.2018.8591153

Development of multi-axis high-precision stage using multistep wireless power transfer. / Yazaki, Yuma; Ohnishi, Wataru; Imura, Takehiro et al.
Proceedings: IECON 2018 - 44th Annual Conference of the IEEE Industrial Electronics Society. Institute of Electrical and Electronics Engineers Inc., 2018. p. 4799-4804 8591153 (Proceedings: IECON 2018 - 44th Annual Conference of the IEEE Industrial Electronics Society).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Development of multi-axis high-precision stage using multistep wireless power transfer

AU - Yazaki, Yuma

AU - Ohnishi, Wataru

AU - Imura, Takehiro

AU - Fujimoto, Hiroshi

AU - Sakata, Koichi

AU - Hara, Atushi

AU - Chen, Zhaoxiang

AU - Yokoyama, Kazuhiro

AU - Suzuki, Kazuhiro

PY - 2018/12/26

Y1 - 2018/12/26

N2 - The most critical problem in high-precision stages for semiconductor and LCD manufacturing is cable disturbance, which can be caused by power cables and communication lines. In our previous study, we designed a novel single-axis high-precision stage using wireless power transfer technology, which avoids cable disturbance. Here, we further develop this concept and propose a multi-axis wireless high-precision. Experimental results demonstrate the effectiveness of the multi-axis wireless high-precision stage.

AB - The most critical problem in high-precision stages for semiconductor and LCD manufacturing is cable disturbance, which can be caused by power cables and communication lines. In our previous study, we designed a novel single-axis high-precision stage using wireless power transfer technology, which avoids cable disturbance. Here, we further develop this concept and propose a multi-axis wireless high-precision. Experimental results demonstrate the effectiveness of the multi-axis wireless high-precision stage.

UR - http://www.scopus.com/inward/record.url?scp=85061527695&partnerID=8YFLogxK

U2 - 10.1109/IECON.2018.8591153

DO - 10.1109/IECON.2018.8591153

M3 - Conference contribution

AN - SCOPUS:85061527695

T3 - Proceedings: IECON 2018 - 44th Annual Conference of the IEEE Industrial Electronics Society

SP - 4799

EP - 4804

BT - Proceedings

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 44th Annual Conference of the IEEE Industrial Electronics Society, IECON 2018

Y2 - 20 October 2018 through 23 October 2018

ER -

Yazaki Y, Ohnishi W, Imura T, Fujimoto H, Sakata K, Hara A et al. Development of multi-axis high-precision stage using multistep wireless power transfer. In Proceedings: IECON 2018 - 44th Annual Conference of the IEEE Industrial Electronics Society. Institute of Electrical and Electronics Engineers Inc. 2018. p. 4799-4804. 8591153. (Proceedings: IECON 2018 - 44th Annual Conference of the IEEE Industrial Electronics Society). doi: 10.1109/IECON.2018.8591153

Development of multi-axis high-precision stage using multistep wireless power transfer

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