@inproceedings{7e803184258543b6ad7b788feac17ce4,
title = "Development of Au/Pt/Ti multilayers for wafer-level packaging and residual gas gettering",
abstract = "We demonstrated that Au/Pt/Ti (from top to bottom) metal multilayers enables wafer-level packaging of degassed assemblies and residual gas gettering. A hermetic sealing was fabricated by Au surfaces after degassing annealing at 200°C. In addition, the Ti underlayer atoms diffused to the internal surface by annealing at 450°C, enabling the gas in the package. As the Au/Pt/Ti layers have the functions of the bonding layer and gas getter, the proposed packaging technique can potentially simplify a vacuum sealing process.",
keywords = "Degas annealing, Direct bonding, Gettering of residual gas, MEMS, vacuum packaging",
author = "S. Kariya and T. Matsumae and Y. Kurashima and H. Takagi and M. Hayase and E. Higurashi",
note = "Publisher Copyright: {\textcopyright} 2021 IEEE.; 20th International Conference on Electronics Packaging, ICEP 2021 ; Conference date: 12-05-2021 Through 14-05-2021",
year = "2021",
month = may,
day = "12",
doi = "10.23919/ICEP51988.2021.9451937",
language = "English",
series = "2021 International Conference on Electronics Packaging, ICEP 2021",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "69--70",
booktitle = "2021 International Conference on Electronics Packaging, ICEP 2021",
}