Development of a pressure-sensitive adhesive utilizing a highly sensitive cross-linking system with photoanionic curing

Keyphrases

• Highly Sensitive 100%
• Linked System 100%
• Pressure-sensitive Adhesive 100%
• Pressure Sensitive Adhesive Tape 100%
• Addition Reaction 33%
• UV Radiation 33%
• Low Pressure 33%
• High Sensitivity 33%
• Photobase Generator 33%
• Temperature Test 33%
• UV-curable 33%
• Room Air 33%
• Semiconductor Devices 33%
• High Heat Resistance 33%
• Curing Reaction 33%
• Peel Strength 33%
• Solvent-free 33%
• Curability 33%
• Shear Adhesion 33%
• Novel Copolymer 33%
• Adhesion Failure 33%
• Thermal Curing 33%
• Failure Temperature 33%
• Developed Pressure 33%
• Rapid Curing 33%
• Acrylic Pressure-sensitive Adhesives 33%

Material Science

• Copolymer 100%
• Heat Resistance 100%
• Semiconductor Device 100%