TY - JOUR
T1 - Correlation between the Cross-Plane Thermal and Electrical Conductance in Randomly Stacked MoS2
AU - Zhou, Kaiyao
AU - Ueji, Kan
AU - Shiga, Takuma
AU - Nishidome, Hiroyuki
AU - Saito, Shigeki
AU - Nakamura, Sota
AU - Endo, Takahiko
AU - Yomogida, Yohei
AU - Miyata, Yasumitsu
AU - Kobayashi, Junei
AU - Yamamoto, Takahiro
AU - Yagi, Takashi
AU - Yanagi, Kazuhiro
N1 - Publisher Copyright:
© 2024 American Chemical Society.
PY - 2024
Y1 - 2024
N2 - van der Waals (vdW) interface is a critical component in the performance of flexible devices, such as electronics, thermal, and thermoelectric devices. Recent advances in interface design with two-dimensional (2D) materials have allowed for studying various controlled interface properties. Understanding the heat and charge transport correlation is essential for optimizing flexible device performance. However, due to experimental limitations, the correlation between the heat and charge transport characteristics across 2D vdW interfaces has not yet been elucidated. Here, we revealed the thermal and electrical conductance across four randomly stacked MoS2 layers. The simultaneous determination of cross-plane thermal and electrical conductance can be achieved using time-domain thermoreflectance measurements using Au as a metal transducer. A linear correlation between thermal and electrical conductance was observed by vacuum annealing, and such behavior can be understood by the change in interlayer distance from theoretical calculations. Our study offers insights into thermal management for nanodevices using stacked 2D materials.
AB - van der Waals (vdW) interface is a critical component in the performance of flexible devices, such as electronics, thermal, and thermoelectric devices. Recent advances in interface design with two-dimensional (2D) materials have allowed for studying various controlled interface properties. Understanding the heat and charge transport correlation is essential for optimizing flexible device performance. However, due to experimental limitations, the correlation between the heat and charge transport characteristics across 2D vdW interfaces has not yet been elucidated. Here, we revealed the thermal and electrical conductance across four randomly stacked MoS2 layers. The simultaneous determination of cross-plane thermal and electrical conductance can be achieved using time-domain thermoreflectance measurements using Au as a metal transducer. A linear correlation between thermal and electrical conductance was observed by vacuum annealing, and such behavior can be understood by the change in interlayer distance from theoretical calculations. Our study offers insights into thermal management for nanodevices using stacked 2D materials.
KW - electrical conductance
KW - thermal conductance
KW - time-domain thermoreflectance
KW - transition metal dichalcogenide
KW - van der Waals interfaces
UR - http://www.scopus.com/inward/record.url?scp=85200388349&partnerID=8YFLogxK
U2 - 10.1021/acsaelm.4c00911
DO - 10.1021/acsaelm.4c00911
M3 - Article
AN - SCOPUS:85200388349
SN - 2637-6113
JO - ACS Applied Electronic Materials
JF - ACS Applied Electronic Materials
ER -