TY - JOUR
T1 - Bonding formation and gas absorption using Au/Pt/Ti layers for vacuum packaging
AU - Kariya, Shingo
AU - Matsumae, Takashi
AU - Kurashima, Yuichi
AU - Takagi, Hideki
AU - Hayase, Masanori
AU - Higurashi, Eiji
N1 - Funding Information:
This study was supported by JSPS KAKENHI (Grant Number JP19H02045).
Publisher Copyright:
© 2022, The Author(s).
PY - 2022/12
Y1 - 2022/12
N2 - In this study, we developed a metal multilayer that can provide hermetic sealing after degassing the assemblies and absorbing the residual gases in the package. A package without a leak path was obtained by the direct bonding of the Au/Pt/Ti layers. After packaging, annealing at 450 °C caused thermal diffusion of the Ti underlayer atoms to the inner surface, which led to absorption of the residual gas molecules. These results indicated that a wafer coated with a Au/Pt/Ti layer can provide hermetic sealing and absorb residual gases, which can simplify vacuum packaging processes in the electronics industry.
AB - In this study, we developed a metal multilayer that can provide hermetic sealing after degassing the assemblies and absorbing the residual gases in the package. A package without a leak path was obtained by the direct bonding of the Au/Pt/Ti layers. After packaging, annealing at 450 °C caused thermal diffusion of the Ti underlayer atoms to the inner surface, which led to absorption of the residual gas molecules. These results indicated that a wafer coated with a Au/Pt/Ti layer can provide hermetic sealing and absorb residual gases, which can simplify vacuum packaging processes in the electronics industry.
UR - http://www.scopus.com/inward/record.url?scp=85123048720&partnerID=8YFLogxK
U2 - 10.1038/s41378-021-00339-x
DO - 10.1038/s41378-021-00339-x
M3 - Article
AN - SCOPUS:85123048720
VL - 8
JO - Microsystems and Nanoengineering
JF - Microsystems and Nanoengineering
SN - 2055-7434
IS - 1
M1 - 2
ER -