Bonding formation and gas absorption using Au/Pt/Ti layers for vacuum packaging

Shingo Kariya, Takashi Matsumae, Yuichi Kurashima, Hideki Takagi, Masanori Hayase, Eiji Higurashi

Research output: Contribution to journalArticlepeer-review

Abstract

In this study, we developed a metal multilayer that can provide hermetic sealing after degassing the assemblies and absorbing the residual gases in the package. A package without a leak path was obtained by the direct bonding of the Au/Pt/Ti layers. After packaging, annealing at 450 °C caused thermal diffusion of the Ti underlayer atoms to the inner surface, which led to absorption of the residual gas molecules. These results indicated that a wafer coated with a Au/Pt/Ti layer can provide hermetic sealing and absorb residual gases, which can simplify vacuum packaging processes in the electronics industry.

Original languageEnglish
Article number2
JournalMicrosystems and Nanoengineering
Volume8
Issue number1
DOIs
Publication statusPublished - Dec 2022

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