A novel device for fixing small object using through chip porous silicon layer

Masanori Hayase, Atsuko Kato, Atsushi Uchiumi

Research output: Contribution to journalArticle


A novel device that enables fixing small objects at a specified point on a silicon substrate was developed. It will be useful if cell or other small objects can be fixed in a row on a chip and drug dosage to the each object can be controlled. By arranging objects in a row, observation will become easy and quick. In this study, patterned through chip porous Si areas were made using photolithographic patterning and anodized porous silicon. Permeability of air and water through the porous layer was measured. It was demonstrated that a polystyrene bead dispersed in pure water was fixed on a through chip porous area of 7μm × 7μm by vacuum suction.

Original languageEnglish
Pages (from-to)1056-1061
Number of pages6
JournalSeimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Issue number10
Publication statusPublished - Oct 2008



  • Anodization
  • Cell manipulation
  • MEMS
  • Porous silicon

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