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Fingerprint Dive into the research topics where Masanori Hayase is active. These topic labels come from the works of this person. Together they form a unique fingerprint.

Plating Engineering & Materials Science
Electrodes Engineering & Materials Science
Porous silicon Engineering & Materials Science
fuel cells Physics & Astronomy
Fuel cells Engineering & Materials Science
Silicon Engineering & Materials Science
Substrates Engineering & Materials Science
electrodes Physics & Astronomy

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Research Output 1994 2020

  • 512 Citations
  • 13 h-Index
  • 47 Article
  • 22 Conference contribution
  • 9 Conference article
  • 1 Paper

Mitigation of channel clogging in a microfluidic device for capturing circulating tumor cells

Konishi, T., Jingu, Y., Yoshizawa, T., Irita, M., Suzuki, T. & Hayase, M., 1 Jan 2020, In : International Journal of Automation Technology. 14, 1, p. 109-116 8 p.

Research output: Contribution to journalArticle

Microfluidics
Tumors
Blood
Cells
Platelets

A miniature fuel cell with monolithically fabricated Si electrodes: Application of Au-Pd-Pt multilayer catalyst

Shirai, R., Irita, M., Kurose, T., Vasiljevic, N. & Hayase, M., 1 Jan 2019, In : Journal of the Electrochemical Society. 166, 15, p. D834-D842

Research output: Contribution to journalArticle

Open Access
Atomic layer deposition
Carbon Monoxide
fuel cells
Fuel cells
Monolayers

Miniature Fuel cell with Monolithically Fabricated Si Electrode -First prototype with Au-Pd-Pt multilayer catalyst-

Kurose, T., Shirai, R., Vasiljevic, N. & Hayase, M., 4 Dec 2019, In : Journal of Physics: Conference Series. 1407, 1, 012008.

Research output: Contribution to journalConference article

Open Access
fuel cells
prototypes
catalysts
electrodes
poisoning
1 Citation (Scopus)

Observation of the behavior of additives in copper electroplating using a microfluidic device

Akita, T., Tomie, M., Ikuta, R., Egoshi, H. & Hayase, M., 1 Jan 2019, In : Journal of the Electrochemical Society. 166, 1, p. D3058-D3065

Research output: Contribution to journalArticle

Open Access
microfluidic devices
electroplating
Electroplating
Microfluidics
Copper

Observation of the behavior of additives in copper electroplating using a microfluidic device

Hayase, M., Akita, T., Tomie, M., Ikuta, R. & Egoshi, H., 1 Jan 2019, 2019 International Conference on Semiconductor Technology for Ultra Large Scale Integrated Circuits and Thin Film Transistors, ULSIC vs. TFT 2019. Kuo, Y. (ed.). 1 ed. Electrochemical Society Inc., p. 73-77 5 p. (ECS Transactions; vol. 90, no. 1).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Electroplating
Microfluidics
Copper
Plating
Electrodeposition