Research output per year
Research output per year
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Dive into the research topics where Department of Electrical Engineering is active. These topic labels come from the works of this organisation's members. Together they form a unique fingerprint.
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A study on ESD protection characteristic difference measurement of TVS diodes by VNA
Yoshida, T. & Endo, M., 16 Jan 2018, Proceedings of 2017 IEEE 5th International Symposium on Electromagnetic Compatibility, EMC-Beijing 2017. Institute of Electrical and Electronics Engineers Inc., p. 1-10 10 p. (IEEE International Symposium on Electromagnetic Compatibility; vol. 2017-October).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
4 Citations (Scopus) -
Fabrication of carbon nanomaterials using supercritical states of ethanol and binary system of ethanol and carbon dioxide for LSI interconnects
Saito, S., Nishikawa, K., Itoh, M. & Uhara, Y., Sep 2018, In: Japanese Journal of Applied Physics. 57, 9, 098005.Research output: Contribution to journal › Article › peer-review
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A consideration of mechanism of audio signa deterioration caused by propagation noise between audio equipment
Fujino, T. & Yoshida, T., 11 Jul 2017, 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2017. Institute of Electrical and Electronics Engineers Inc., p. 155-157 3 p. 7975450. (2017 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2017).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
4 Citations (Scopus) -
Analyses of all-optical gate switches employing quasi-phase matched devices: Effects on pattern difference of domain inversion period error
Fukuchi, Y., Kimura, T., Yoshida, T., Fujisawa, M. & Uzu, E., 19 Nov 2017, 22nd Microoptics Conference, MOC 2017. Institute of Electrical and Electronics Engineers Inc., p. 282-283 2 p. (22nd Microoptics Conference, MOC 2017; vol. 2017-November).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
1 Citation (Scopus) -
A study on response characteristics modeling method for ESD protection device by vector network analyzer
Kimura, N. & Yoshida, T., 11 Jul 2017, 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2017. Institute of Electrical and Electronics Engineers Inc., p. 66-68 3 p. 7975426. (2017 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2017).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
3 Citations (Scopus) -
A study on signature/sign authentication with touching information on smart phone
Yoshida, T., Tanaka, Y. & Hangai, S., 14 May 2017, Proceedings of the 2017 9th International Conference on Bioinformatics and Biomedical Technology, ICBBT 2017. Association for Computing Machinery, p. 80-83 4 p. (ACM International Conference Proceeding Series; vol. Part F128534).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
3 Citations (Scopus) -
Evaluation of Correlation between Orientation of Y3Fe5O12 (YIG) Thin Film and Spin Seebeck Effect
Yamamoto, A., Arai, M., Takimoto, T., Itoh, M., Ando, S., Saito, S. & Kawahara, T., Nov 2017, In: IEEE Transactions on Magnetics. 53, 11, 7924318.Research output: Contribution to journal › Article › peer-review
1 Citation (Scopus) -
A study on electrical stress induced by electrostatic discharge on wearable devices
Yoshida, T., 29 Dec 2015, Proceedings - 7th Asia-Pacific Conference on Environmental Electromagnetics, CEEM 2015. Yougang, G., Dan, S. & Lihua, S. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 230-233 4 p. 7368672. (Proceedings - 7th Asia-Pacific Conference on Environmental Electromagnetics, CEEM 2015).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
5 Citations (Scopus) -
A study on system-level ESD stress simulation using circuit simulator
Yoshida, T. & Masui, N., 17 Dec 2015, 2013 Asia-Pacific Symposium on Electromagnetic Compatibility, APEMC 2013. Institute of Electrical and Electronics Engineers Inc., 7360625. (2013 Asia-Pacific Symposium on Electromagnetic Compatibility, APEMC 2013).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
9 Citations (Scopus)